
, PO and Wire.
|
Type |
Board Level, Extrusion |
|
|
Package Cooled |
|
|
|
Attachment Method |
Press Fit |
|
|
Shape |
Rectangular, Fins |
|
|
Length |
5.000" (127.00mm) |
|
|
Width |
4.000" (101.60mm) |
|
|
Diameter |
- |
|
|
Fin Height |
4.000" (101.60mm) |
|
|
Power Dissipation @ Temperature Rise |
50.0W @ 38°C |
|
|
Thermal Resistance @ Forced Air Flow |
0.30°C/W @ 500 LFM |
|
|
Thermal Resistance @ Natural |
0.76°C/W |
|
|
Material |
|
|
|
Material Finish |
Black Anodized |
| General Information | |
| Product | Heat Sinks |
| Mounting Style | Screw |
| Heatsink Material | Aluminum |
| Fin Style | - |
| Thermal Resistance | - |
| Length | 127 mm |
| Width | 101.6 mm |
| Height | 101.6 mm |
| Designed for | Stud Mounted Semiconductor Cases |
WARNING:: The plastic used in cable products can expose you to lead and lead components,
chemicals known to the State of California to cause cancer, birth defects, or other reproductive harm.
For more information go to www.P65Warnings.ca.gov