Type |
Board Level, Extrusion |
|
Package Cooled |
|
|
Attachment Method |
Press Fit |
|
Shape |
Rectangular, Fins |
|
Length |
5.000" (127.00mm) |
|
Width |
4.000" (101.60mm) |
|
Diameter |
- |
|
Fin Height |
4.000" (101.60mm) |
|
Power Dissipation @ Temperature Rise |
50.0W @ 38°C |
|
Thermal Resistance @ Forced Air Flow |
0.30°C/W @ 500 LFM |
|
Thermal Resistance @ Natural |
0.76°C/W |
|
Material |
|
|
Material Finish |
Black Anodized |
General Information | |
Product | Heat Sinks |
Mounting Style | Screw |
Heatsink Material | Aluminum |
Fin Style | - |
Thermal Resistance | - |
Length | 127 mm |
Width | 101.6 mm |
Height | 101.6 mm |
Designed for | Stud Mounted Semiconductor Cases |